Industry News | 2018-10-11 19:18:30.0
series, a very small (only 300 mm width) yet modular bed of nails tester especially suitable for deployment in as a series of equivalent systems, loaded either manually or via a COBOT solution.
Industry News | 2021-07-29 05:26:00.0
Unicomp LX2000 AXI X-Ray equipment are widely applied in Electronics and Semiconductor Industry
Industry News | 2023-12-25 15:04:22.0
South-Tek Systems is pleased to announce Chris Putney of TechSystems as its Rep of the Year 2023 for achieving top sales. This prestigious award reflects Mr. Putney's outstanding dedication to driving sales in Northern California.
Industry News | 2008-08-26 15:20:45.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, introduces SP200-AV2, a new model of its automated stencil printer SP200. The printer is an advanced version of the previous generation system and offers increased robustness, precision and ease of use.
Industry News | 2012-05-29 09:09:09.0
A showcase for South China's entire electronics manufacturing chain
Industry News | 2020-11-09 14:19:56.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS'sonline thermal management conference from Nov. 25-26.
Industry News | 2008-12-19 14:11:28.0
The three-day Bohai Electronics Week 2008 (BEW08) closed its doors at the Tianjin International Exhibition Centre on another highly successful event for the industry. BEW 2008 provided a unique, quality trading platform for more than 100 leading enterprises in this region and successfully attracted 3,947 visiting professionals from areas in North China including Tianjin, Beijing, Shandong and Shenyang, with 1,380 VIP visitors and buyers.
Industry News | 2012-11-16 11:54:40.0
NEPCON Chinawill take place at the Shanghai World Expo Convention & Exhibition Center between April 23 and April 25, 2013.
Industry News | 2014-05-20 23:43:21.0
"Our New Test Dimensions to Ride Your Products' Innovation". Seica's participation in this exhibition will address all dimensions of board test, from prototype to mass production, to field repair, implemented on a variety of solutions, based on a common hardware and software core, but focused at your environment, performance, efficiency and cost requirements.
Industry News | 2009-09-17 14:35:25.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.
