Industry News | 2008-11-20 16:03:20.0
Integrated Ideas & Technologies, Inc. has developed a prototype solder paste printing tool, the Desktop Companion II.
Industry News | 2013-10-09 08:35:53.0
SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.
Industry News | 2012-01-24 20:39:23.0
A pioneer in the SMT solder paste stencil industry, UTZ Technologies of Little Falls, NJ, continues to stay at the cutting-edge of stencil technology with the recent purchase of a G6080 StencilLaser from LPKF Laser & Electronics.
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Industry News | 2019-10-08 06:05:58.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.
Industry News | 2008-10-29 17:30:39.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.
Industry News | 2010-03-30 15:51:22.0
HONG KONG - WKK Distribution Ltd., the leading supplier of industrial machinery and materials in Asia, announces that Lionel Fullwood, Technical Director, will present a paper titled "A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources" at the upcoming IPC/APEX conference and exhibition,
Industry News | 2023-10-30 19:24:35.0
Ventec International Group Co., Ltd. (6672 TT) will once again team up with partner Taiyo to promote the synergy between Ventec's substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242.
Industry News | 2011-11-08 14:17:32.0
Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.