Industry News: electric resistance (Page 1 of 28)

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Connectors Handle Up to 54A Safely Onboard

Industry News | 2003-05-19 08:44:19.0

Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

IPC Releases E-Textiles Standard IPC-8921

Industry News | 2020-01-07 11:09:15.0

IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.

Association Connecting Electronics Industries (IPC)

IPC Releases E-textiles Standard, IPC-8921

Industry News | 2019-12-19 17:48:47.0

IPC announces the release of IPC-8921, Requirements for Woven and Knitted Electronics Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires.

Association Connecting Electronics Industries (IPC)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

All about Semiconductor

Industry News | 2018-12-08 03:37:02.0

All about Semiconductor

Flason Electronic Co.,limited

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

Industry News | 2018-04-09 19:51:33.0

SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Minimum Thickness PCB

Industry News | 2018-10-18 10:56:54.0

Minimum Thickness PCB

Flason Electronic Co.,limited

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