Industry News | 2017-01-17 15:17:33.0
The SMTA is pleased to announce the Call for Abstracts for the International Conference on Soldering and Reliability June 6-8, 2017 in Markham, Ontario, Canada. The deadline to submit an abstract is February 28, 2017.
Industry News | 2013-05-15 11:48:55.0
IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.
Industry News | 2014-06-08 14:35:23.0
IPC’s Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Zentech Manufacturing Inc., an electronics and engineering service firm in Baltimore, Md.
Industry News | 2022-08-08 07:04:14.0
IPC's Validation Services program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to DFI, Inc., a leading supplier of high-performance embedded solutions, industrial motherboards and custom products technology, worldwide.
Industry News | 2018-06-04 18:00:34.0
If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2012-08-23 16:23:11.0
IPC — Association Connecting Electronics Industries®. Joining the illustrious ranks of only three other companies, MacDermid, Inc. and Northrop Grumman are celebrating 50-year membership anniversaries
Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Industry News | 2018-06-26 20:35:35.0
The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Industry News | 2013-01-28 07:29:00.0
IPC APEX EXPO® debut new products and services
