Industry News: electrical clearance bga balls 610 (Page 1 of 1)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

PDR's New Affordable PCB X-ray Inspection Systems Offer Quality Image Clarity

Industry News | 2020-06-07 04:44:33.0

PDR X-ray Solutions is pleased to announce that its 2D and 2D+ X-ray systems have set a new industry standard for high-quality X-ray images at an affordable price. Choosing the correct system for your requirements such as X-ray for quality control or X-ray for process control is vital for the success of both X-ray circuit board inspection programs as well as X-ray semiconductor inspection programs.

PDR-America

Indium Corporation Technology Experts to Present at APEX

Industry News | 2014-02-27 11:48:51.0

Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.

Indium Corporation

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