Industry News | 2003-06-26 08:12:04.0
He replaces Robert J. Schutz
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2008-08-14 13:20:36.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2011-10-08 18:45:48.0
Flexible printed circuits are electro – mechanical devices. They require sound design practices to be successful. This presentation will cover these design techniques which focus on stress management and the flex material properties which drives these design techniques resulting in robust flex circuit designs.
Industry News | 2012-06-08 20:33:10.0
Count On Tools Inc.announces that PB Swiss Tools, a leading partner for quality tools world-wide, has released the newest generation of PB Torque Tools with VDE design for work on electrical devices.
Industry News | 2014-03-07 13:11:52.0
Count On Tools Inc. announces that PB Swiss Tools, a leading partner for quality tools worldwide, has released the newest generation of PB Torque Tools with MecaTorque VDE design for work on electrical devices.
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2024-03-26 13:16:51.0
The SMTA announces three conferences taking place in Europe this spring.
Industry News | 2019-08-21 16:17:24.0
Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.
Industry News | 2017-07-19 15:29:48.0
The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
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