Industry News: electrolytic 20cmp corrosion (Page 1 of 1)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

What are the Major Causes of Variable Frequency Drive (VFD) Damage?

Industry News | 2021-12-07 20:24:41.0

Variable frequency drive belongs to electronic products, which were composed of many components. An electronic product will not correctly work if any component goes wrong. The Common failures of frequency converters are overvoltage, overload, overcurrent and overheating. They are generally caused by improper use and the operating environment. Meanwhile, there's a particular service life for electronic products. The aging of the product will be more evident as the use of time increases.

OKmarts Industrial Parts Mall

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Lora Soil Moisture Sensor V3 - What Updated?

Industry News | 2021-10-28 22:06:34.0

In the past few months, we made a big upgrade for the new version of Lora soil moisture. In this article, we will introduce the great improvements on Makerfabs Lora Soil Moisture sensor V3!

Makerfabs

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