Industry News: electrolytic and gold and thickness (Page 2 of 2)

Cleaning, activation and coating/metallization with cold-active plasma under atmospheric pressure. The new dimension in plasma treatment

Industry News | 2009-12-08 15:08:44.0

Reinhausen Plasma will be presenting the first ever cold-active plasma tools at the productronica – the Plasmabrush, Piezobrush and Plasmadust. The innovative Plasmabrush and Piezobrush open up a whole range of new application fields with regard to the pre-treatment and activation of substrate surfaces.

Reinhausen Plasma GmbH

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Industry News | 2021-08-13 12:16:35.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.

CyberOptics Corporation

Würth Elektronik offers the best contact between flex-rigid PCBs and ZIF connectors

Industry News | 2010-05-05 23:20:11.0

Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.

Würth Elektronik GmbH & Co. KG

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Industry News | 2010-02-19 09:45:37.0

Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding

Sensor Products Inc.

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Industry News | 2012-05-11 20:19:04.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.

Hesse Mechatronics

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

MARCH Products | Nordson Electronics Solutions

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