Industry News: electrolytic gold (Page 1 of 2)

Frigid Climate, Industry Can't Stop Some from UIC Seminar

Industry News | 2003-02-07 09:13:12.0

The Sessions Covered Current and Emerging Technologies

SMTnet

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

LCR-Reader-MPA Makes Debut at Nepcon 2019

Industry News | 2019-06-28 14:40:30.0

Siborg Systems Inc. gave the first viewing of LCR-Reader-MPA for the first time in Korea from May 15- 17 2019

Siborg Systems Inc

LCR-Reader-MPA; Updated Multifunctional Multimeter

Industry News | 2019-04-15 16:47:35.0

New model of LCR-Reader-MP on the horizon; updated model offers record high basic accuracy and unparalleled amount of test functions

Siborg Systems Inc

New Yorker Electronics Distributes Exxelia Miniature Low-Pass Filter Capacitors

Industry News | 2020-12-21 09:11:22.0

Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences

New Yorker Electronics

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

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