Industry News: ems/ultra electronics mark 3 (Page 30 of 45)

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Industry News | 2017-08-15 21:23:51.0

Nihon Superior will exhibit in Booth #532 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Acculogic Offers Production Board Test Systems for the Automotive Industry

Industry News | 2017-09-25 14:51:54.0

Acculogic announces plans to exhibit in Booth #13006 at the Automotive Testing Expo, scheduled to take place Oct. 24-26, 2017 at the the Suburban Collection Showplace in Novi, MI. The company will feature the Scorpion BRiZ and a Battery Array Tester.

Acculogic Inc.

Data I/O to Showcase High-Performance PSV Family and LumenX Programming Technology at APEX

Industry News | 2019-01-04 16:19:27.0

Data I/O Corporation will showcase the PSV7000, PSV5000, Lumen®X programming platform with Universal Flash Storage (UFS) programming and the ConneX® software in Booth #2015 at the IPC APEX Expo, scheduled to take place January 29th – January 31st at the San Diego Convention Center in San Diego, CA.

Data I/O Corporation

Kurtz Ersa Inc. Introduces Auto Scavenger Module for Leading HR 600 XL Rework System

Industry News | 2023-06-26 09:26:37.0

Kurtz Ersa Inc. is pleased to unveil the new Auto Scavenger Module, a valuable extension for the Ersa HR 600 XL rework platform. Designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards, this module represents a significant advancement in rework technology. The Ersa HR 600 XL is the technologically leading rework platform for large electronic assemblies.

kurtz ersa Corporation

Lufthansa Develops Personal Air Travel Plan for NEPCON China 2015

Industry News | 2014-12-29 06:42:54.0

From 21 to 23 April 2015, the mega event in electronics manufacturing - the 25th edition of NEPCON China will be held at the Shanghai World Expo Exhibition & Convention Center. NEPCON China, one of the largest SMT exhibitions of Electronics Manufacturing Automation (EMA) equipment and techniques in Asia, is co-organized by the world’s largest exhibition organizer, Reed Exhibitions, and the CCPIT Electronics & Information Industry Sub-council. It is one of the most authoritative events in electronics manufacturing across China and Asia-Pacific. As an event organizer deeply trusted by industry professionals.

Reed Exhibitions

Hover-Davis demonstrates new Radial, Tube, Tray, Label and Die-cut material automation solutions at IPC Apex Expo

Industry News | 2020-01-24 14:03:39.0

Hover-Davis will demonstrate its new Radial, Tube and Tray feeders at the 20th IPC Apex Expo. Developed in partnership with Universal Instruments, these innovative feeders solve the packaging challenges of larger SMD and odd-form electronic components such as relays, connectors, capacitors, LEDs, and more. Originally proven on Universal’s Uflex™ and FuzionOF™ automation systems, the company’s new odd-form feeders are now available through Hover-Davis, with interface kits available for a wide range of automation system integration applications.

Hover-Davis

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

CyberOptics' New SQ3000™+ System Powered by MRS™ Sensor Technology Recognized with 2022 NPI Award

Industry News | 2022-02-25 14:38:43.0

CyberOptics® Corporation (NASDAQ: CYBE) received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Inspection for its new SQ3000+ Multi-Function system for AOI, SPI and CMM. The award was announced during a virtual ceremony on Thursday, Feb. 24, 2022.

CyberOptics Corporation

Valor Computerized Systems reports Q3 2004 results;

Industry News | 2004-11-02 06:29:01.0

Revenues rise 23% setting new record level

Valor Computerized Systems

Nihon Superior’s Keith Howell to Present at International Conference on Soldering and Reliability

Industry News | 2010-05-05 21:42:51.0

OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.

Nihon Superior Co., Ltd.


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