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Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Industry News | 2012-02-22 01:32:21.0

Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.

Engineered Materials Systems, Inc.

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