Industry News | 2013-03-27 15:04:06.0
The Enterprise Data eXchange (or EDX) Solutions Alliance was established today to provide an open industry forum for the broad adoption of its new standard, EDX. EDX is a new and robust data format created to capture PCB-related IP in a standard form for safe and secure data-sharing with enterprise systems and remote third parties.
Industry News | 2008-08-07 12:32:07.0
COLORADO SPRINGS, CO � August 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will exhibit TV-1000 TWEEZER-VAC, DTV-2000 TWEEZER-VAC and VSPT series of small parts tips in booth 326 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008, at Disney's Coronado Springs Resort and Convention Center in Orlando, FL.
Industry News | 2012-03-07 22:05:34.0
Mentor Graphics announced the latest release of the PADS® product suite, the world’s most widely used desktop PCB design solution. These additional features in the release add significant value to electronics companies as they strive to deliver the most competitive, high-performance products to market faster.
Industry News | 2017-01-11 17:14:16.0
Mentor Graphics today announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® platform for the design and verification of TSMC’s InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications. Mentor developed new Xpedition functionality specifically to support InFO and enable the IC package designer to complete design tasks to TSMC specification. By leveraging the capabilities of both the Calibre and HyperLynx® technologies, the new Xpedition functionality minimizes the designer effort and design rule checking (DRC) cycles required to achieve a DRC-clean InFO GDS file.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
Industry News | 2010-11-03 20:02:42.0
Kyzen announces that Dr. Mike Bixenman, Steve Stach from Austin American Corporation, and Curtis Hart from Hart Engineering will teach a technical workshop at the upcoming High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.
Industry News | 2011-01-26 20:33:39.0
Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.
Industry News | 2011-09-28 19:30:18.0
Multitest announces that the MT2168 fully leverages today’s tester capabilities in terms of shorter test times and higher parallelism, e.g. 16 sites.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2012-08-23 11:35:21.0
BTU International (Nasdaq: BTUI),today announced that it will exhibit in Booth L004 at the upcoming International Touch Panel and Optical Film Exhibition
