Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2009-12-03 22:49:57.0
Gene F. Wakefield Passed away on November 29, 2009 after a courageous battle with pancreatic cancer. He was born on December 22, 1933 in Albuquerque, New Mexico. He is survived by his wife, LaJuana. He leaves behind a daughter, Marvel Wakefield (Los Angeles, CA), two brothers, John Wakefield (Crawford, CO) and Roy Wakefield (Truckee, CA), three sisters, Lila Craig (Colorado Springs, CO), Mary Alyce Krist (Ft. Collins, CO) and Margaret Ann Foss (Buffalo, WY).
Industry News | 2020-03-25 12:00:41.0
After an extensive evaluation BOSCH has selected MIRTEC's 3D AOI Technology as the best solution to meet their ongoing quality initiatives.
Industry News | 2008-07-16 21:38:29.0
Excerpts taken from the article Will Electronics Follow the Sun? written by Irene Sterian and printed July 1, 2008 in Circuits Assembly Magazine
Industry News | 2018-02-01 02:56:53.0
More is not less, rather more is completely free. These newly released features were originally available to our enterprise-level customers, and now available at absolutely no cost, no obligation, no strings attached, to automate creation of tens of millions of parts...
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2013-07-09 14:17:09.0
IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 13th Electronic Circuits World Convention (ECWC13) taking place May 7–9, 2014, at the Nuremberg Convention Center, Germany.
