Industry News: enig shelf life (Page 1 of 14)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

Industry News | 2012-05-30 18:23:07.0

IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics

Association Connecting Electronics Industries (IPC)

Clariant Whitepaper on Performance and Sustainability of Bentonite Clay Desiccants in Moisture Controlled Packaging

Industry News | 2017-10-05 12:40:41.0

The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.

Clariant Cargo & Device Protection

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Super PCB Offers High-Quality Surface Finishes

Industry News | 2018-11-27 14:03:14.0

Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.

Super PCB

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

Technic Releases Black Pad Resistant Electroless Nickel

Industry News | 2012-01-03 10:40:18.0

Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.

Technic Inc.

Practical Components Adds Test Board for 0.3 mm Pitch Dummy CVBGA Test Vehicle

Industry News | 2012-01-17 11:05:35.0

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Practical Components, Inc.

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