Industry News | 2020-05-30 12:36:38.0
SEHO Systems GmbH has registered the patent for a new mini-wave solder nozzle that remarkably improves the selective soldering process in many ways. The patent-pending LongLife solder nozzle is compatible with both SEHO selective soldering systems and different brands.
Industry News | 2012-03-09 16:13:42.0
Seika Machinery will highlight its new, innovative products at the upcoming SMTA Indiana Expo & Trade Forum.
Industry News | 2009-04-08 16:12:41.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.
Industry News | 2012-01-30 13:43:45.0
Seika Machinery will highlight many new, innovative products at the upcoming SMTA Dallas Expo and Tech Forum.
Industry News | 2012-05-31 21:23:25.0
Seika Machinery, Inc. will display its new and innovative products at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2001-06-26 09:50:17.0
The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.
Industry News | 2014-03-20 19:08:08.0
Computrol, Inc. today announced that it has purchased Technical Devices Company’s patent-pending Flood Box technology for inline cleaning.
Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2017-05-01 05:11:48.0
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place May 16-18 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
