Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2010-04-23 22:01:16.0
BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-05-21 20:39:06.0
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2018-06-03 19:35:57.0
Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.
Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
Industry News | 2024-07-08 11:04:21.0
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a Qualified Products Listing (QPL) requalification to IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2013-04-04 15:28:32.0
The report, published this week, shows what market segments underlie the disappointing 10 percent contraction in February PCB sales versus February of last year.
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
