Industry News | 2010-09-20 20:12:05.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its full rate SPI-4.2 solution based on a low cost, low power FPGA fabric.
Industry News | 2012-07-24 07:03:23.0
With Alternative Tracks, the SIPLACE team has made the setup process in electronics manufacturing even more flexible.
Industry News | 2014-02-20 14:47:22.0
Viscom announced today that it will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #524 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-07-28 12:42:54.0
Viscom will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China. Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.
Industry News | 2014-07-28 21:55:58.0
Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2016-02-15 17:53:06.0
Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.
Industry News | 2016-02-17 17:43:57.0
Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.
Industry News | 2016-04-20 16:52:02.0
Viscom presents the industry‘s most advanced and comprehensive range of high-performance X-ray inspection systems in booth #1J20 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World Expo Exhibition Center.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
Industry News | 2021-01-06 17:14:49.0
Intelligent Manufacturing Solutions, LLC (IMS) recently installed the Assure™ X-ray Component Counter from DAGE, part of Nordson ELECTRONICS SOLUTIONS, at their Manchester, NH location. More than a Printed Circuit-Board Assembly (PCBA) or Electronics Manufacturing Services (EMS) provider, IMSis a partner committed to working smarter and faster--in a way that puts customers first. The company focuses on high-mix, low-volume production and specializes in rapidly sourcing, assembling and testing short runs quickly, efficiently, and cost-effectively.
