Industry News | 2001-03-20 10:13:46.0
Valor Computerized Systems today announced an agreement with WebQuote Software to develop an integrated, web-enabled PCB procurement solution driven directly from the design engineer's desktop. Based on the ODB++ high-level data exchange format, this new service will provide OEMs and contract manufacturers with online PCB procurement services supported by data automatically extracted from Valor's DFM and assembly and test software, Enterprise 3000 and Trilogy 5000.
Industry News | 2002-03-19 07:12:16.0
Delivering Valor Parts Library directly into Syncron�s Universal Design Network achieves more than 50% cost savings per PCB footprint
Industry News | 2003-12-24 03:52:46.0
Exclusive technology-partnership positions Valor for substantial growth in core electronics manufacturing PLM market.
Industry News | 2004-05-10 18:35:11.0
Google going public
Industry News | 2009-11-01 18:10:15.0
The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.
Industry News | 2012-07-13 07:31:28.0
Low-cost tablet PC manufactured with State-of-the-art SIPLACE placement solutions
Industry News | 2014-07-23 13:05:22.0
Mentor Graphics today announced its next offering in the new Xpedition® platform, the Xpedition Data Management (xDM) product suite. The xDM Design product suite provides a flow-wide information hub that manages the PCB design data that is created, reused, imported, or released from the Mentor Graphics® Xpedition Enterprise platform.
Industry News | 2014-10-28 19:26:30.0
Mentor Graphics Corporation (NASDAQ: MENT)today announced its newest offering and key building block in the Xpedition® platform, the Xpedition Systems Designer product for multi-board systems connectivity. The Xpedition Systems Designer product captures the hardware description of multi-board systems, from logical system definition down to the individual PCBs, automating multi-level system design synchronization processes to ensure team collaboration with accuracy and faster design productivity.
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
Industry News | 2017-11-21 15:27:38.0
Viscom AG announces the release of vVision 2.4, successfully delivered since mid-2017 for its modern operating software. Among the most important optimizations are a time-saving inspection program creation – especially for new components and special component types – and comprehensive 3D advancements like the 3D solder joint inspection for chips.
