Industry News | 2017-01-23 10:42:18.0
Kurtz Ersa North America has completed its financial results for 2016 and announces its third record setting year in all regions of the world.
Industry News | 2016-02-15 20:36:38.0
Kurtz Ersa North America will exhibit in Booth #1326 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Ersa will introduce its new line of selective solder, reflow and rework equipment and more.
Industry News | 2016-03-15 16:00:03.0
Kurtz Ersa North America announces that it was awarded four 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Ersa won in the following categories: Component Placement – Multi-function for the ROBOPLACE, Soldering – Selective for the VERSAFLOW 4, Soldering – Reflow for the HOTFLOW 3/20 and Software – Process Control for the IMAGESOFT Software.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
| 1 |
winsouce.jpg)