Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Industry News | 2002-03-19 08:04:17.0
ESEC received a 2001 Preferred Quality Supplier (PQS) award from Intel Corp. for outstanding performance in providing products and services deemed essential to Intel's success. The company was awarded for its efforts in supplying Intel with flip chip attach equipment and die bonders.
Industry News | 2010-10-27 20:21:50.0
Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
Industry News | 2012-08-29 10:27:05.0
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Industry News | 2013-03-11 09:10:32.0
A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Industry News | 2016-07-25 15:46:30.0
Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.
Industry News | 2013-01-04 08:55:03.0
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
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