Industry News: essemtec flex-2010 c (Page 1 of 3)

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

Essemtec Benelux Expands Activities and Relocates to Aarschot

Industry News | 2014-06-17 10:40:11.0

Effective June 2, 2014 Essemtec Benelux moved to Aarschot where the new site offers a far superior space with offices, warehouse, a demo room and a larger spare parts stock.

ESSEMTEC AG

Essemtec Brazil Exhibits at FIEE and Opens Training Center in Campinas, SP

Industry News | 2013-03-12 14:06:44.0

Essemtec Brazil is substantially expanding its sales and service organization in Brazil to provide the highest level of quality in all aspects of its business.

ESSEMTEC AG

Essemtec to Introduce World's First SMT Assembler with Integrated Solder Paste Jet Printer at APEX 2014

Industry News | 2014-02-19 16:09:53.0

Essemtec will debut its new SMT production centre in booth #851 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas.

ESSEMTEC AG

High Demand For Scorpion, Essemtec’s New Dispensing System

Industry News | 2012-04-02 12:41:15.0

Since the premier of the Scorpion at productronica 2011 in Munich, Essemtec has noted a record high in demand. Due to its outstanding price-performance ratio, the new dispensing machine is among the best dispensers in the world. Its accuracy of ±25 μm is extraordinary and it can dispense up to 100,000 dots per hour.

ESSEMTEC AG

Essemtec Brings Paraquda 4C with PFV to SMTA International

Industry News | 2013-09-14 09:00:12.0

Essemtec will exhibit in booth #827 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

ESSEMTEC AG

Essemtec to Introduce Nanojet Dispensing System For Adhesives, Oil And Lubricants at NEPCON China 2008

Industry News | 2008-04-07 19:26:19.0

Essemtec announces it will introduce the Nanojet Dispensing System, CDS6250 in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

ESSEMTEC AG

Essemtec to Introduce World's First SMT Assembler with Integrated Solder Paste Jet Printer at APEX 2014

Industry News | 2014-01-29 02:29:02.0

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will debut its new SMT production centre in booth #851 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.

ESSEMTEC AG

Essemtec's Compact Desk Reflow and Curing Oven Offers Lead-Free Soldering Capability

Industry News | 2008-12-03 16:12:20.0

The RO06-PLUS batch oven from Essemtec offers lead-free soldering capability as well as curing programs with durations up to 18 hours. The oven features a small footprint, integrated microprocessor control and fully automatic processing. Its main applications include prototyping, small batch manufacturing and testing.

ESSEMTEC AG

ESSEMTEC to Highlight Flexible Swiss-Made Solutions at SMTAI 2011

Industry News | 2011-09-21 13:21:51.0

Essemtec will showcase flexible Swiss-made solutions in Booth #127 at the upcoming SMTA International Conference & Exhibition.

ESSEMTEC AG

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