Industry News: essemtec flx 2010 (Page 1 of 5)

MORE THAN 120 NEW PRODUCTS TO DEBUT AT IPC APEX EXPO

Industry News | 2010-03-22 15:12:19.0

BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

High Mix SMD Pick+Place

Industry News | 2004-10-15 10:33:00.0

The new FLX2010 SMD pick+place from ESSEMTEC offers the most flexible

ESSEMTEC AG

ESSEMTEC to Introduce More Placement Efficiency with FLX2010-BLV at APEX 2008

Industry News | 2008-02-29 16:13:23.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

Production cell for flexible PCB

Industry News | 2005-03-18 12:10:43.0

New pick & place series FLX2010-MK (MK=Membrane Keyboard)

ESSEMTEC AG

Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates

Industry News | 2008-05-18 01:34:26.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it can perform material dispensing and consecutive placement of LEDs on film substrates.

ESSEMTEC AG

ESSEMTEC to Premier FLX2011 to North American Industry at IPC Midwest 2008

Industry News | 2008-09-12 04:06:36.0

Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will introduce its multifunctional FLX2011 Flexible Pick-and-Place System to the North American market in booth 907 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

ESSEMTEC AG

ESSEMTEC Wins a 2008 SMT China Vision Award for FLX2011

Industry News | 2008-04-17 16:18:25.0

Aesc, Switzerland � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it has been awarded a 2008 SMT China Vision Award in the category of Pick-and-Place � Multi-Function for its FLX2011 Flexible Pick-and-Place System. The award was presented during an April 8, 2008 ceremony that took place at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China.

ESSEMTEC AG

ESSEMTEC to Highlight Range of Equipment at APEX 2010

Industry News | 2010-03-24 13:19:39.0

Glassboro, NJ — Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will feature a range of new equipment in booth 1059 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

ESSEMTEC AG

World Premiere of FLEXUS-Pick-and-Place Platform at SMT Hybrid Packaging 2013

Industry News | 2013-05-13 05:25:41.0

Essemtec expands its range of machines with the new pick-and-place machine FLEXUS. The machine is tied to the established FLX system, but offers a greater flexibility in the high-mix/mid-volume sector.

ESSEMTEC AG


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