Industry News | 2008-11-04 15:09:53.0
Saturn Electronics Corp. Heavy Copper Mulilayer Bare Boards
Industry News | 2013-03-21 07:15:36.0
M.E. Baker Company announces FY 2013 first quarter equipment sales to Goodrich Corporation, Northrop-Grumman, and Hutchinson Technology for automated etching and deburring processes.
Industry News | 2015-03-16 11:44:31.0
PNC is proud to announce the latest add-on qualification of product testing to Military Performance Specification MIL-PRF-31032, CAGE Code 66766.
Industry News | 2016-07-04 04:48:26.0
we are PCB manufacture in China, 20 years experiences. Providing variety PCB inks, include liquid photoimageable solder mask, etching resist ink;UV curing solder mask. anti-acid etching resist ink. Special LED white ink and so on. We also providing positive /negative photo resist ink.We hammer at offering to client best quality, competitive price, full service for our clients. We appreciate your any inquires and reply you immediately.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Industry News | 2017-07-14 12:20:09.0
Lumberton, NJ - Fine Line Stencil (FLS) and Metal Etching Technology (MET) Associates announce they are merging. The new company will be known as BlueRing Stencils. BlueRing Stencils will maintain 8 manufacturing locations across the USA (TX, NJ, NH, CA, FL, IN, MN & NC). Fred Cox of MET has been appointed President of BlueRing Stencils. Mr. Cox said, “We look forward to providing improved technology and greater service to all of our stencil customers. Our combined companies will allow us to offer the latest innovations in SMT stencil printing.”
Industry News | 2015-07-01 15:44:06.0
Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
