Industry News: every layer interconnect (Page 1 of 25)

Park Electrochemical Corp. Declares Cash Dividend

Industry News | 2003-03-24 09:38:49.0

Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Teradyne Awarded Two Service Excellence Awards at APEX

Industry News | 2003-04-07 10:25:38.0

Customers Commend Teradyne's Assembly Test and Connection Systems Divisions

SMTnet

Exploring Innovations in Electronics Manufacturing for Medical Devices IPC conference focuses on every stage of the medical devices supply chain

Industry News | 2013-05-07 18:04:23.0

, IPC — Association Connecting Electronics Industries® will host a one-and-a-half day conference, “Innovations in Electronics in Manufacturing for Medical Devices,” June 12–13 in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Technology Trends Study Underway, Survey Open Until January 31

Industry News | 2014-01-14 18:37:40.0

IPC – Association Connecting Electronics Industries® released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study.

Association Connecting Electronics Industries (IPC)

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Industry News | 2018-07-10 20:52:09.0

High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.

Association Connecting Electronics Industries (IPC)

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Industry News | 2018-04-09 19:48:04.0

SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

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