Industry News: evolution (Page 1 of 22)

Blackfox/Evolution Announce Updated Veteran Advanced Manufacturing Certification Program

Industry News | 2022-05-23 21:35:08.0

Blackfox Training Institute is proud to announce their latest development in their Veteran Advanced Manufacturing Certification program. This program was originally launched in 2013 and more than a hundred Veterans have been through it since. It was created out of a partnership between Blackfox Training Institute, Lockheed Martin, Colorado Department of Labor & Education, and a deep passion for serving those that have served and protected us. Over a hundred Veterans were trained and subsequently employed at advanced manufacturing companies along Colorado's Front Range.

Blackfox Training Institute, LLC

The PCB Industry Loses Pioneer in Ken Armitage

Industry News | 2003-02-05 08:17:11.0

Ken was the President and Owner of Lazer-Tech

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

WHMA 27th Annual Wire Harness Conference to Offer Workshop on the Evolution of IPC’s Cable and Wire Harness Documents

Industry News | 2019-10-30 18:25:26.0

Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)

Hutchins Grant Award Winner Announced

Industry News | 2014-11-25 17:04:36.0

During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

Dr. Nathan Blattau, R&D Fellow at Ansys, to Present at SMTA Capital Chapter Meeting on April 6th

Industry News | 2021-03-25 15:48:41.0

The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.

Surface Mount Technology Association (SMTA)

SMTA Recognizes Two Speakers

Industry News | 2002-03-27 09:42:31.0

Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards

Surface Mount Technology Association (SMTA)

2009 SMTA Anaheim Academy Program Announced

Industry News | 2008-12-06 02:08:39.0

Anaheim, CA � The SMTA is pleased to announce the 2009 SMTA Anaheim Academy program. SMTA Anaheim will be held February 10-11, 2009 at the Anaheim Convention Center in conjunction with Electronics West. This year's program will feature six half-day Courses led by leading instructors in the industry.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium Announced

Industry News | 2021-08-13 12:11:05.0

The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.

Surface Mount Technology Association (SMTA)

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