Industry News: evs (Page 2 of 23)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2010-10-20 21:21:00.0

The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

IWLPC Best Papers Announced

Industry News | 2015-01-15 19:44:09.0

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Surface Mount Technology Association (SMTA)

Nordson DAGE Selected to Join a UK Consortium to Develop Test & Inspection Technologies for High-Volume Battery Manufacturing

Industry News | 2019-09-18 16:29:29.0

Nordson DAGE is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK’s low-carbon automotive capabilities. As part of the UK government’s Industrial Strategy, five projects totaling £33M were awarded through the Advanced Propulsion Centre (APC).

ASYMTEK Products | Nordson Electronics Solutions

IPC to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

Industry News | 2023-06-13 18:25:04.0

Electronics manufacturers to gather in Chennai August 1 and Pune, India, August 3

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO 2024 Offers More Than 100 Technical Sessions in Electronics Manufacturing

Industry News | 2024-01-29 10:55:37.0

The industry's premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.

Association Connecting Electronics Industries (IPC)


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