Industry News: excess flux after reflow (Page 6 of 13)

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Industry News | 2009-11-02 21:59:00.0

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

FCT ASSEMBLY, INC.

Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing

Industry News | 2013-12-10 12:14:34.0

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corporation

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Nihon Superior Announces Successful Product Launches at NEPCON Japan

Industry News | 2015-01-27 10:29:53.0

Nihon Superior recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.

Nihon Superior Co., Ltd.

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.

BTU to display new Aurora Platform for the first time in Asia at NEPCON China 2023

Industry News | 2023-06-26 09:18:15.0

BTU International, Inc. will exhibit its new Aurora reflow platform at NEPCON China. The show is scheduled to take place July 19-21, 2023 at the Shanghai World Expo Exhibition & Convention Center. The new Aurora 150N, 12-zone reflow oven will be on display in booth #1D38.

BTU International

CERTI puts its trust in ERSA

Industry News | 2010-10-07 14:49:04.0

A recently placed purchase order by the renowned Brazilian CERTI-Institute brought smiles on the faces of management and employees of ERSA. After successfully concluding the negotiations with the management of CERTI, ERSA was awarded a contract for delivery of production machinery and other equipment for the electronic production, valuing approximately 1, 2 Million €.

kurtz ersa Corporation

Application of lead-free solder

Industry News | 2018-10-18 09:34:29.0

Application of lead-free solder

Flason Electronic Co.,limited


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