Industry News | 2016-06-13 14:57:43.0
Kurtz Ersa North America is pleased to announce that Joseph Clure, Application / Process Engineer, will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28th at Kester’s Global Headquarters in Itasca, IL.
Industry News | 2018-03-11 11:49:14.0
After the first successful edition, the Seica Seminar took place again in Israel on 20th February 2018. Our local representative Spider Engineering was able to perfectly arrange an amazing event in the beautiful location of the Daniel Hotel in Herzliya with over 130 people attending. The participants, a real technological elite, were representing a large number of defense institutions, government corporation and private companies showing once more the complexity and the extremely high value of Israeli market in the electronics environment.
Industry News | 2018-03-16 08:19:25.0
After the first successful edition, the Seica Seminar took place again in Israel on 20th February 2018. Our local representative Spider Engineering was able to perfectly arrange an amazing event in the beautiful location of the Daniel Hotel in Herzliya with over 130 people attending. The participants, a real technological elite, were representing a large number of defense institutions, government corporation and private companies showing once more the complexity and the extremely high value of Israeli market in the electronics environment.
Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2011-06-07 14:33:33.0
LPKF has added another laser system to its repertoire. The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs.
Industry News | 2012-11-15 17:07:54.0
Inovar Inc. announces executive team changes to further the company’s goals and mission. Effective November 1, 2012
Industry News | 2014-01-10 17:04:31.0
AIM Solder is pleased to announce the appointment of Mr. Can Li to the position of Sales Manager. Effective 1 December, 2013, Li will be responsible for AIM’s sales development in the eastern and northern regions of China and will be based in Suzhou, China.
Industry News | 2015-04-06 20:19:03.0
Seika Machinery announces that effective April 1, 2015, Malcomtech International is a part of Seika Machinery, Inc. (SMI), based in Torrance, CA.
Industry News | 2016-06-22 16:26:34.0
Horizon Sales today announced that effective immediately, Joshua Casper has joined the sales team, covering Eastern Michigan and Northern Ohio.
