Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2019-06-11 10:33:49.0
KYZEN announced plans to exhibit at SEMICON West, scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The KYZEN team will offer free cleaning assessments and an inside look at their chemistries, MICRONOX® M2322 and MICRONOX® M2708, in Booth #5369.
Industry News | 2018-06-11 19:02:50.0
KYZEN announced plans to exhibit in Booth #5976 at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2017-06-13 20:22:20.0
Today KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2015-04-07 17:14:44.0
KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2015-04-02 10:28:43.0
KYZEN’s innovative new product technology team will exhibit in the InterCEM booth C111 at Electronics Manufacturing Korea, scheduled to take place April 1-3, 2015 in Coex, Seoul. Company representatives will showcase a full line of products for electronic assembly and advanced packaging cleaning.
Industry News | 2015-04-06 12:08:31.0
KYZEN’s innovative new product technology team will exhibit in booth #101 at SEMICON Southeast Asia, scheduled to take place April 22-24, 2015 at the SPICE Arena in Penang, Malaysia. KYZEN’s team will display a full line of products for electronic assembly and advanced packaging cleaning including MICRONOX® 2710 and MICRONOX® 2707.
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