Industry News: exposed copper wire (Page 3 of 22)

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

Industry News | 2022-05-18 13:01:33.0

Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus

Hand Crimping is Obsolete with the Perfect Pair

Industry News | 2013-05-20 09:19:02.0

With the help of Schleuniger, Jabil, Inc. switched from hand tools to automatic crimping machines achieving labor and cost savings.

Schleuniger, Inc.

TopLine Sponsors IMAPS Wire Bonding Conference

Industry News | 2018-03-13 18:47:01.0

TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

TopLine Dummy Components

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Industry News | 2013-04-13 00:16:30.0

Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.

Hesse Mechatronics

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

PCB Outline Layer And Keep-out Polygon Clearance

Industry News | 2018-10-18 11:13:35.0

PCB Outline Layer And Keep-out Polygon Clearance

Flason Electronic Co.,limited

Super PCB Offers High-Quality Surface Finishes

Industry News | 2018-11-27 14:03:14.0

Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.

Super PCB

Aven Launches Accu-Cut Cutters: Precise and Reliable Tools for Cutting Soft Copper Wire

Industry News | 2023-05-08 08:15:40.0

Aven is pleased to introduce its Accu-Cut cutters. These diagonal pliers or wire cutters are specially designed to make clean and precise cuts in tight spaces, making them an indispensable tool for electricians, DIY enthusiasts, and professionals in various industries.

Aven, Inc


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