Industry News | 2016-10-04 19:16:23.0
Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Industry News | 2014-01-24 16:21:17.0
Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.
Industry News | 2014-06-24 14:40:24.0
Standard Gerber is technically obsolete. If you are still using it, you are putting your business and that of your clients and business partners at a useless risk, without benefit.
Industry News | 2014-03-12 13:55:52.0
BALVER ZINN today announced that it has granted a sub-license to Estaños Senra S.L. for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing and sales throughout Spain.
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2023-03-06 17:22:53.0
ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society's (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
Industry News | 2010-01-17 22:28:38.0
OSAKA, JAPAN — January 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in Booth # East 31-12 in the East 6 Hall of East Exhibit Building at the upcoming INTERNEPCON Japan 2010, scheduled to take place January 20-22, 2010 at the Tokyo Big Site.
