Industry News: extra pad (Page 1 of 3)

Tens of Millions of Footprints & 3D Models for FREE

Industry News | 2017-05-11 17:06:16.0

Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.

PCB Libraries, Inc.

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2013-06-11 19:23:26.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

What is a HDI PCB?

Industry News | 2018-10-18 11:05:03.0

What is a HDI PCB?

Flason Electronic Co.,limited

How to Solder a Surface Mount Device to a PCB Pad

Industry News | 2018-10-18 09:02:41.0

How to Solder a Surface Mount Device to a PCB Pad

Flason Electronic Co.,limited

How To Design Cost-Effective PCBs

Industry News | 2018-10-18 11:19:07.0

How To Design Cost-Effective PCBs

Flason Electronic Co.,limited

IPC COMPLIANT 9850 Kit

Industry News | 2003-05-14 17:13:16.0

CHECKS OUT PICK AND PLACE MACHINES

Practical Components, Inc.

Vi TECHNOLOGY to showcase the most innovative SPI product since the introduction of Moiré systems

Industry News | 2018-04-22 19:27:32.0

Vi TECHNOLOGY today announced that it will exhibit with its representative at the S.E.E. Scandinavian Electronic Event, scheduled to take place April 24-26, 2018 at the Kista Expo Center in Sweden. Wretom will showcase the PI Series 3D SPI in Booth C02:30.

Vi TECHNOLOGY

Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726

Industry News | 2016-09-22 18:12:16.0

Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

SAKI America

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