Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2013-01-15 12:52:06.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announced today that the Atlanta SMTA Expo would return to the Gwinnett Civic Center in Duluth,
Industry News | 2015-03-12 17:36:01.0
The Surface Mount Technology Association (SMTA) announced today that the Atlanta SMTA Expo would return to the Gwinnett Civic Center in Duluth, Georgia for its 19th annual event on Wednesday, April 15, 2015 from 10:00 AM to 3:00 PM. Technical sessions begin at 9:15 AM and the show floor opens at 10:00 AM. This free, one-day event will feature suppliers to the electronics industry displaying products and services for the high technology and surface mount markets, as well as free technical presentations.
Industry News | 2006-05-25 19:52:40.0
Engelmaier Associates, L.C. announces the availability of a multi-client study/white paper titled: "WHITE PAPER REPORT: Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality."
Industry News | 2008-02-04 11:15:15.0
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
Industry News | 2002-04-11 08:13:43.0
Sheldahl�s Sales Slipped 21% in 2001, According to the Company�s Filing With the U.S. Securities Exchange Commission
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
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