Industry News: fail bga (Page 1 of 2)

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Get a Free ERSA Mobile Scope with Purchase of ERSA Rework System

Industry News | 2011-10-28 20:29:08.0

ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.

kurtz ersa Corporation

ASCENTECH to Introduce GEN3 CM+ Systems at IPC/APEX 2016

Industry News | 2016-02-15 13:57:31.0

Ascentech will be introducing the new GEN3 CM+ Systems at IPC/APEX. These systems will be shown for the first time in North America during IPC/APEX. On display in booth #2225 will be the CM22+, one of the award-winning CM+ range of contaminometers from GEN3. This new design is linked to the introduction of the new process control metric introduced by GEN3, e.g., Process Ionic Contamination Testing.

Ascentech LLC

VJE’s Don Naugler and BEST’s Bob Wetterman to Present during Technical Session SMT3 at SMTA International 2013

Industry News | 2013-09-16 14:38:01.0

VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.

VJ Electronix

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

BSU Inc. Updates High-Performance X-ray Inspection Capability

Industry News | 2021-05-10 02:50:10.0

BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...

BSU Incorporated

Saline Lectronics to Install Factory-wide Traceability from Cogiscan

Industry News | 2013-12-03 15:52:18.0

Saline Lectronics, Inc.announces that it has purchased Cogiscan’s Track, Trace and Control (TTC) system.

Saline Lectronics, Inc

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