Industry News: fcr (Page 1 of 1)

Pillar Flip Chip Applications at SEMICON West

Industry News | 2016-06-22 16:15:35.0

KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.

KYZEN Corporation

Kingston Technology Releases 6 in 1 USB Flash Card Reader

Industry News | 2002-04-15 08:28:35.0

New Reader is the Ideal Data Transfer Solution Between Today's Portable Devices and Computing Systems

Kingston Technology

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