Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
Industry News | 2021-03-02 14:47:04.0
Eutect GmbH further developed and optimized its Sensitive Wire Feeder (SWF). The world's only patented intelligent wire feeder can be used in conjunction with a laser, iron or induction system for soldering assemblies. As part of its continuous product development, the Swabian soldering specialist is now presenting a new development version of the successful product.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2024-03-11 14:47:44.0
Austin American Technology (AAT) is pleased to announce that its patented rotational spraying method ensures superior cleaning performance, delivering consistent results for critical electronic components. This revolutionary technique is integrated into the company's X Series Stencil Cleaner.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2023-11-20 14:50:19.0
Kurtz Ersa Inc. today announced that it received two 2023 GLOBAL Technology Awards. The awards recognize excellence in the categories of Repair and Rework for the Auto Scavenger Module for the Ersa Rework System HR 600 XL, and Selective Soldering for the VERSAFLOW ONE X-Series. The esteemed awards ceremony took place during productronica in Munich on Nov. 14, 2023.
Industry News | 2011-11-08 15:15:40.0
MYDATA is introducing a new Agilis Flex feeder solution for larger components, which extends the reach of its proprietary Agilis feeder technology.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
