Industry News | 2008-01-23 20:31:34.0
The International Engineering Consortium's (IEC) today announced that it will host a record-breaking number of exhibitors at DesignCon 2008 this February 4�7 in Santa Clara
Industry News | 2009-09-17 15:00:44.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.
Industry News | 2010-06-23 13:52:01.0
IMAPS is proud to announce two world-renowned industry leaders as Keynote Speakers at the 43rd International Symposium on Microelectronics (IMAPS 2010, November 2-4, 2010, Raleigh Convention Center, Raleigh, NC.
International Microelectronics Assembly and Packaging Society (IMAPS)
Industry News | 2010-07-20 12:24:29.0
Krayden, Inc., a leading distributor of engineered materials, announces that its Fernando Montes de Oca was presented the Gold Award from Dow Corning Electronics for the “Distributor Sales Professional of the Year 2009,” in a ceremony on May 19, 2010 at Krayden’s headquarters in Denver.
Industry News | 2010-09-30 17:36:09.0
Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.
Industry News | 2011-03-21 13:35:30.0
JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs.
Industry News | 2011-05-06 21:25:40.0
The annual NEPCON China exhibition, a celebration of China electronics manufacturing and the SMT industry, will be held in May this year, with an abundance of products and brilliant activities beyond expectation.
Industry News | 2011-11-08 13:42:40.0
Nihon Superior was honored to receive a visit by a delegation from the University of Queensland
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2012-08-01 16:44:06.0
Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
