Industry News: fill hole (Page 11 of 16)

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-01-16 13:33:47.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-02-19 10:13:23.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008

Industry News | 2008-08-07 15:26:07.0

Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.

Nihon Superior Co., Ltd.

Pin-in-Paste Reflow Calculations and Special Cases

Industry News | 2018-10-18 08:43:30.0

Pin-in-Paste Reflow Calculations and Special Cases

Flason Electronic Co.,limited

Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at Internepcon Japan 2008

Industry News | 2007-12-05 22:55:10.0

OSAKA, JAPAN � December 4, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth EAST6 59-18 at the upcoming Internepcon Japan exhibition, scheduled to take place January 16-18, 2008 at the Tokyo Big Sight Exhibition Center, Japan.

Nihon Superior Co., Ltd.

Nihon Superior�s SN100C Wins Two 2008 NPI Industry Awards

Industry News | 2008-04-07 22:33:54.0

OSAKA, JAPAN � March 31, 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded two 2008 NPI Awards with the Balver Zinn Balver Zinn Group (Balver Zinn, Nihon Superior Co. Ltd., FCT Assembly and DKL Metals) in the category of Soldering Materials and Flux for its innovative SN100C Paste. The awards were presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

Nihon Superior Co., Ltd.

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.


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