Industry News: fill hole (Page 4 of 16)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Industry News | 2019-04-30 17:39:40.0

The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.

Surface Mount Technology Association (SMTA)

Via Hole Filling

Industry News | 2010-09-08 11:49:17.0

PCB Fabricator Installs MASS VHF 300 VS for Via Hole Filling Addressing the continuous demands pertaining to via hole filling, through holes and blind vias

Saturn Electronics Corporation

Ventec Giga Solutions Appointed as Distributor for Sunus Printing Machines

Industry News | 2023-11-13 12:22:31.0

Ventec Giga Solutions, the equipment division of Ventec International Group announces its appointment by Sunus Precision Machinery as sales agent and distributor of Vacuum Filling Holes Solutions and Screen Printing Equipment. The agreement covers all regions globally outside of Asia.

Ventec International Group

“Defect of the Month” videos online 24/7 with Bob Willis

Industry News | 2017-01-21 08:16:49.0

Welcome to this Bob Willis “Defect of the Month” video This month we cover Poor Hole Fill on PCBs during Soldering https://www.youtube.com/watch?v=BlSF9ubGEA8

ASKbobwillis.com

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Industry News | 2020-10-04 15:41:30.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions

Nihon Superior Introduces NS-F850 Flux for Lead-Free Wave Soldering

Industry News | 2009-01-23 02:17:04.0

OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces NS-F850 rosin-based flux for lead-free wave soldering.

Nihon Superior Co., Ltd.

Nihon Superior's NS-F850 Wins a 2009 NPI Award

Industry News | 2009-04-08 20:51:10.0

OSAKA, JAPAN � March 2009 � Nihon Superior announces that it has been awarded a NPI Award in the category of Flux for its NS-F850. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.

Nihon Superior Co., Ltd.

Cobar Solder Products to Exhibit High Performance Fluxes at the 2011 Pan Pacific Microelectronics Symposium

Industry News | 2011-01-12 14:24:53.0

The Balver Zinn Group announces that Cobar Europe BV will exhibit a completely new range of high-performance low-VOC and VOC-free fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 18-20, 2011at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.

Cobar Solder Products Inc.

Cobar Solder Products to Exhibit High-Performance Fluxes at IPC APEX EXPO 2011

Industry News | 2011-03-11 14:58:49.0

The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete new range of high-performance low-VOC and VOC-free fluxes in Booth #371 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Cobar Solder Products Inc.


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