Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2011-02-07 15:23:56.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 11:28:37.0
Surface Mount (SMT) Assembly Cost in China
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2017-04-27 17:50:10.0
In response to mounting concern about the shortage of U.S. workers with skills needed by electronics manufacturers, IPC – Association Connecting Electronics Industries® conducted a “fast-facts” study to learn more about the skills gap as it affects U.S. electronics assembly manufacturers. The results, published last week within Findings on the Skills Gap in U.S. Electronics Manufacturing, indicate that most companies are having a hard time recruiting qualified production workers, and an even harder time finding qualified engineers and other technical professionals.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2011-03-28 13:24:06.0
Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
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