Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2018-10-18 09:57:05.0
Why is my PCB Assembly Quote so Expensive?
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2014-01-03 18:29:15.0
Surface Mount Technologies, Inc. announces that it has teamed with Eruston Corporation to offer complete turnkey manufacturing.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
