Industry News | 2015-12-04 13:06:33.0
December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.
Industry News | 2008-05-18 00:59:26.0
HUDSON, NH � May 13, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that it is able to measure all types of SMT equipment with its flexible mobile measurement method.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Industry News | 2022-08-14 14:26:09.0
SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2011-01-10 11:03:55.0
Microcomputer Systems Components (MSC), a leading European component distributor and programming service provider, goes on the record about its preference for BPM Microsystems’ automated programming solutions in the September issue of Productronic magazine. The interview with MSC’s Manager of Programming Services Martin Hinz occurred just after the company’s second 4710 automated production programmer purchase for its Stutensee facility.
Industry News | 2008-03-25 22:37:25.0
Comment from Steve DiMarco, Vice President of Sales & Marketing
Industry News | 2009-09-17 14:39:48.0
FINETECH’s Neil O’Brien will present “Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT4, titled “Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30 a.m.
Industry News | 2020-12-18 19:19:05.0
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
Industry News | 2021-04-13 04:38:05.0
MacDermid Alpha Electronics Solutions was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
Industry News | 2017-05-01 14:53:34.0
ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
