Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2004-02-20 12:15:19.0
Tabletop Stencil Cleaner
Industry News | 2008-07-22 13:24:53.0
Starting at less than $8000...and it's a Smart Sonic!
Industry News | 2014-02-11 14:27:26.0
Transition Automation will attend the Apex IPC trade show in Las Vegas. Transition's booth #1237 will exhibit the latest PrinTEK System MP1818, and a full line of Permalex Edge Metal Squeegees and Universal Holder Systems for retrofitting top brand In-line SMT printers manufactured throughtout the world.
Industry News | 2015-03-24 04:15:40.0
This year my special feature area in the US, supported by SMTA & NPL, will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of pastes, plus some of the key in-process inspection steps to make a process perform correctly. It will also include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects.
Industry News | 2021-05-14 05:49:33.0
Seika Machinery, Inc. today introduced the new SC-MM7VE Screen Mask Cleaner from Sawa. The system is ideal for users who clean a large number of screens per day and have several size patterns of screens or fine-pitch screens.
Industry News | 2008-02-29 16:13:23.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2009-09-17 14:39:48.0
FINETECH’s Neil O’Brien will present “Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT4, titled “Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30 a.m.
Industry News | 2013-07-05 17:24:15.0
SMART Group announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.
Industry News | 2008-06-03 15:08:51.0
COLORADO SPRINGS, CO � June 3, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the availability of LPKF Laser Technology/SMT Stencil Laser Technology.
