Industry News | 2018-10-18 09:57:05.0
Why is my PCB Assembly Quote so Expensive?
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Industry News | 2004-10-15 16:35:07.0
To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1.
Industry News | 2009-02-27 21:12:43.0
HOUSTON � February 2009 � BPM announces that it will feature the 3000FS Flash Memory Programmer in Hall 7 Booth # D-120 in distributor Esman's booth at the upcoming Electrotech 2009, scheduled to take place February 26-March 1, 2009 in Istanbul, Turkey.
Industry News | 2009-11-11 13:00:52.0
Manncorp has introduced a pick-and-place system aimed at OEMs who wish to prototype and perform other short-run PCB assembly in-house. Utilizing newly developed cut strip feeders, the 7700-FV provides the high precision and versatility needed for placement of today’s advanced SMDs, including 0402 chip components, CSPs, BGAs, and fine pitch QFPs. Even 0201s can be mounted with optional nozzle and feeder.
Industry News | 2011-02-07 15:33:41.0
Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2014-02-21 11:40:56.0
Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
