Industry News: fine pitch qfp (Page 1 of 64)

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp

SMTA Announces Lead-Free Soldering Technology Symposium Schedule at SMTA International

Industry News | 2013-08-01 13:16:42.0

The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.

Surface Mount Technology Association (SMTA)

Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials

Industry News | 2012-06-09 14:33:06.0

To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.

Association Connecting Electronics Industries (IPC)

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

Call For Papers Issued For IPC Annual Meeting Technical Conference

Industry News | 2001-02-27 22:31:53.0

IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.

Association Connecting Electronics Industries (IPC)

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announce Day 2 Keynote Speaker

Industry News | 2008-08-14 13:20:36.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Surface Mount Technology Association (SMTA)

SMTA INTERNATIONAL 2009 BEST PAPERS ANNOUNCED

Industry News | 2009-12-17 18:14:47.0

MINNEAPOLIS, MN - The SMTA is pleased to announce the Best Papers from SMTA International 2009. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)


fine pitch qfp searches for Companies, Equipment, Machines, Suppliers & Information