Industry News: fine pitch qfp (Page 8 of 64)

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Industry News | 2016-10-09 21:32:22.0

Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng

Shenmao Technology Inc.

ZESTRON Senior Application Engineer, Ravi Parthasarathy, to Present at the SMTA STAR Forum

Industry News | 2023-04-03 13:35:15.0

ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.

3M Electrical Solutions Division

ZESTRON Senior Application Engineer, Ravi Parthasarathy, to Present at the SMTA STAR Forum

Industry News | 2023-04-03 13:45:13.0

ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.

3M Electrical Solutions Division

Europlacer to Feature Flexys-10 at APEX 2008

Industry News | 2008-03-19 14:40:44.0

APEX, NC - March 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Europlacer to Feature Flexys-10 at ExpoElectronica in Moscow

Industry News | 2008-04-08 23:18:54.0

Poole, UK - April 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in distributor booth RTS Engineering located in Hall 13, Pavilion 144, Booth F01 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.

EUROPLACER

Europlacer to Showcase Flexys-10 Intelligent Placement System at APEX 2009

Industry News | 2009-03-20 17:12:01.0

APEX, NC - March 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.

EUROPLACER

ViTrox Technologies Introduces Patented Optical BGA Inspection at SEMICON China

Industry News | 2016-03-07 20:10:00.0

ViTrox Technologies today announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International Expo Centre. The highlights of the show will be the TR2000i, VR20 and Vs 3DBGA!

ViTrox Technologies

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

Industry News | 2022-05-18 13:07:51.0

SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.


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