Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Industry News | 2023-04-03 13:35:15.0
ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
Industry News | 2023-04-03 13:45:13.0
ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
Industry News | 2008-03-19 14:40:44.0
APEX, NC - March 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-04-08 23:18:54.0
Poole, UK - April 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in distributor booth RTS Engineering located in Hall 13, Pavilion 144, Booth F01 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.
Industry News | 2009-03-20 17:12:01.0
APEX, NC - March 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2016-03-07 20:10:00.0
ViTrox Technologies today announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International Expo Centre. The highlights of the show will be the TR2000i, VR20 and Vs 3DBGA!
Industry News | 2010-09-29 23:17:20.0
Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.