Industry News: fine pitch qfp (Page 9 of 64)

Fine Line Stencil Upgrades Step Stencil Technology

Industry News | 2015-12-04 13:06:33.0

December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.

FCT ASSEMBLY, INC.

Juki's High Speed Flexible Assembler Combines Fine Pitch Assembly With Chipshooter Speed

Industry News | 2001-02-06 14:29:53.0

Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed.

Juki Automation Systems

Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Industry News | 2009-01-21 20:01:04.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.

Indium Corporation

ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

Industry News | 2024-03-04 11:49:43.0

ZESTRON proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

3M Electrical Solutions Division

Finetech to Demonstrate Compact Rework System at SMTA International 2007

Industry News | 2007-10-04 17:14:39.0

Tempe, AZ - September 24, 2007 - FINETECH announces that it will demonstrate the Fineplacer� CRS 10 compact rework system in booth 210 at the upcoming SMTA International exhibition, scheduled to take place October 9-10, 2007 in Orlando, FL.

Phoenix United Associates, Inc.

Finetech to Demonstrate Compact Rework System at Nepcon East 2007

Industry News | 2007-10-23 16:19:57.0

Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.

Finetech

Finetech to Demonstrate Compact Rework System at APEX 2008

Industry News | 2008-02-28 15:40:26.0

Tempe, AZ - January 2008 - FINETECH will display the Fineplacer� CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas.

Finetech

CeTaQ Now Offers Capability Analysis of Live �Leaded� Components

Industry News | 2008-10-12 22:46:32.0

BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, now offers capability measurement analysis of leaded devices.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

What's happening at CyberOptics Corporation in 2008?

Industry News | 2008-03-25 22:37:25.0

Comment from Steve DiMarco, Vice President of Sales & Marketing

CyberOptics Corporation

What's happening at FINETECH in 2008?

Industry News | 2008-03-25 23:22:33.0

Comment from Neil O�Brien, Director � US Sales

Finetech


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