Industry News: fine pitch qfp (Page 10 of 64)

Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories

Industry News | 2017-05-01 14:53:34.0

ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.

Vitronics Soltec

MacDermid Alpha Introduces Innovative Solder Paste Enabling Next Generation High Density Assembly Designs

Industry News | 2020-12-18 19:19:05.0

MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Receives New Product Innovation Award for ALPHA OM-372 Solder Paste

Industry News | 2021-04-13 04:38:05.0

MacDermid Alpha Electronics Solutions was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Electronics Solutions

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.

Nihon Superior's SN100C (030) Provides Sharp Spread and Good Separation

Industry News | 2009-03-01 22:13:07.0

OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.

Nihon Superior Co., Ltd.

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Proven Best Cost of Test: Multitest’s ECON® Contactor Exceeds 4.5 mio Insertions

Industry News | 2011-04-20 17:38:48.0

Multitest announces that its well-established ECON® contactor once again has proven its superior cost of test. The contactor recently exceeded 4.5 mio insertions at an Asian test house.

Multitest Elektronische Systeme GmbH

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

Kickstart Your Automation Journey with TR1000S⁺i!

Industry News | 2023-03-24 09:23:31.0

ViTrox, which aims to be the world's most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S⁺i!

ViTrox Technologies

Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011

Industry News | 2011-02-03 14:43:42.0

Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

Multitest Elektronische Systeme GmbH


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