Industry News: fine pitch qfp (Page 10 of 60)

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

Fine Line Stencil Upgrades Step Stencil Technology

Industry News | 2015-12-04 13:06:33.0

December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.

FCT ASSEMBLY, INC.

Proven Best Cost of Test: Multitest’s ECON® Contactor Exceeds 4.5 mio Insertions

Industry News | 2011-04-20 17:38:48.0

Multitest announces that its well-established ECON® contactor once again has proven its superior cost of test. The contactor recently exceeded 4.5 mio insertions at an Asian test house.

Multitest Elektronische Systeme GmbH

Juki's High Speed Flexible Assembler Combines Fine Pitch Assembly With Chipshooter Speed

Industry News | 2001-02-06 14:29:53.0

Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed.

Juki Automation Systems

Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Industry News | 2009-01-21 20:01:04.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.

Indium Corporation

ESSEMTEC to Introduce More Placement Efficiency with FLX2010-BLV at APEX 2008

Industry News | 2008-02-29 16:13:23.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

What's happening at CyberOptics Corporation in 2008?

Industry News | 2008-03-25 22:37:25.0

Comment from Steve DiMarco, Vice President of Sales & Marketing

CyberOptics Corporation

What's happening at FINETECH in 2008?

Industry News | 2008-03-25 23:22:33.0

Comment from Neil O�Brien, Director � US Sales

Finetech

Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories

Industry News | 2017-05-01 14:53:34.0

ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.

Vitronics Soltec

MacDermid Alpha Introduces Innovative Solder Paste Enabling Next Generation High Density Assembly Designs

Industry News | 2020-12-18 19:19:05.0

MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Electronics Solutions


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