Industry News | 2010-06-16 11:38:31.0
GREELEY, CO — FCT Assembly announces the promotion of Robert Dervaes to VP of Technology and Engineering for its Solder division, FCT Solder. Robert has spent the past 12 years working as the VP of Technology and Engineering for Fine Line Stencil, a division of FCT Assembly.
Industry News | 2020-12-18 19:19:05.0
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
Industry News | 2021-04-13 04:38:05.0
MacDermid Alpha Electronics Solutions was awarded the 2021 Circuits Assembly New Product Innovation Award for ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
Industry News | 2008-06-13 16:32:11.0
COLORADO SPRINGS, CO � June 12, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, believes that customer service is key to staying successful in today�s industry. It accomplishes this with the help of its Value Added Technical Support Team.
Industry News | 2009-12-14 20:46:02.0
COLORADO SPRINGS, CO — December 2009 — FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces plans to install an LPKF ScanCheck system in its San Jose, CA stencil facility.
Industry News | 2023-07-10 18:25:44.0
ZESTRON is excited to announce an upcoming webinar titled, "Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs" on July 20th, 2023, at 2:00 PM EST.
Industry News | 2017-02-09 08:35:06.0
FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.
Industry News | 2016-12-26 13:40:59.0
SMT Step Stencils provide increased control over your print process. Vary thickness in any area of your stencil to generate the exact paste volume and height for every single component. A perfect solution for Pin-in-Paste applications. For FREE Technical Assistance please call (760) 798-6984
Industry News | 2017-12-19 19:54:07.0
Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Industry News | 2001-02-16 10:32:40.0
Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed. The KE-2020 is equipped with a high-speed four-nozzle head for placing components and has one fine-pitch placement head with one nozzle capable of placing 0201 components, micro BGAs, CSPs and other odd-shaped components.
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