Industry News | 2008-06-06 23:05:33.0
COLORADO SPRINGS, CO � June 6, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces ElectroLaser�, electroformed laser cut stencils.
Industry News | 2008-06-11 18:26:39.0
FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.
Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2022-08-14 14:26:09.0
SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
Industry News | 2024-07-15 11:41:07.0
ZESTRON is pleased to announce an upcoming webinar titled "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs." The webinar will take place on July 18, 2024, at 2:00 PM EDT.
Industry News | 2009-12-14 20:45:09.0
December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Industry News | 2023-04-03 13:35:15.0
ZESTRON is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
